WHAT IS A HIGH PRESSURE SOLUTION?
Today’s Chips are pushing the limits of traditional scaling
HPSP started as the Equipment Business Team of PSMC in October, 2005. The company expanded its scope by establishing a California branch and was spun off from Poongsan Co., Ltd. in April 2017 and established as HPSP.
HPSP is leading the semiconductor ultra-fine process market by commercializing the high-pressure hydrogen annealing technology, which had existed only in theory.
HPSP is improving the performance of the state-of-the-art semiconductors through high-pressure hydrogen annealing technology.