The high-pressure hydrogen annealing equipment, developed for the first time in the world and produced only by HPSP, is the realization of technology that previously had only been possible in theory.
Based on innovative technology and renowned reliability, HPSP is building up an unmatched history in the semiconductor front-end process.

Leading semiconductor manufacturers adopt high-pressure hydrogen annealing equipment to produce the best system and memory semiconductors, and we are in various stages of preparation to expand our business to incorporate future technologies, including autonomous driving assistive systems (ADAS) and CMOS Image Sensors (CIS).

With all our employees, HPSP will strive to become a leading company in the global market through continuous R&D investment to appropriately address the changing market needs, such as the new high-pressure process development.
CEO  YongWoon KIM